Patents

Tapping predicted markets with a superior new technology

Technology-driven industries are always looking for new products and services. Business models based on technological progress can open up new markets, some of which are still unknown, and thus offer great opportunities.

Ideally, this new market approach is protected by intellectual property in the form of patents. Such future-oriented business models require the assessment of markets, some of which cannot yet be reliably predicted.

Known markets can be assessed, while future markets carry high risks. At the same time, great opportunities open up for first movers (Google approach).

The new 3D patent for heterogeneous semiconductor components has the potential to generate or serve new markets in the field of IOT. For one, these new markets have been well explored - for another, they are probably not even known yet.

The patents presented here can put the holder in an exposed position to generate global market leadership with enormous growth potential in the billion USD range.

Cross-industry innovation for intelligent problem solving

In mobile electronics and IoT, the form factor plays a crucial role - there are precise predictions about the huge market to be expected in the future.

Clearly, this future development is in the necessary 3D integration. 3D integration is therefore being expedited by all leading semiconductor manufacturers and is detailed in many roadmaps.

3D integration represents a major technological challenge for all market participants. A number of different developments were required for its implementation, some of which presented major technological hurdles.

Tasks must always be solved so that they can be implemented in mass production in the industrial environment of semiconductor manufacturing.

The semiconductor industry prefers to solve given tasks with methods that are common and established in the semiconductor industry. This behaviour sometimes neglects processes and technologies that are already successfully applied outside the semiconductor industry.

This is where the solution of SWISS TECHNOLOGY ENTERPRISE comes in. The combination of nozzle printing processes and novel, highly conductive metallic inks, open up revolutionary possibilities in the production of three-dimensional heterogeneous semiconductor components.

Patent-protected technological process

The innovative achievement of SWISS TECHNOLOGY ENTERPRISE was to further develop and adapt an existing technology and to transform it into a viable solution for 3D integration in the semiconductor industry.

It does not require any new basic developments, but adapts existing basic technologies to semiconductors. A three-dimensional printing technology is the new solution here. It is based on two current technological developments that not only offer an intelligent solution but also generate substantial advantages in the application and the result.

Convincing advantages that are easy to realise. Advantages that offer a unique selling proposition that is unsurpassed by any other known technology in terms of economy and flexibility.

SWISS TECHNOLOGY ENTERPRISES do not offer a product or a service, but a technological process that represents the optimal solution for a multitude of applications with a decisive cost advantage over all other approaches.

The business model is similar to models from the life science industry. The addressed IoT market will be huge in absolute size and the new 3D interposer technology will enable many new high-volume applications in life science, biotechnology, telecommunications and many other fields.